Invention Application
- Patent Title: LIGHT-EMITTING DIODE PACKAGE STRUCTURE, COLD CATHODE FLOURESCENT LAMP AND PHOTOLUMINESCENT MATERIAL THEREOF
- Patent Title (中): 发光二极管封装结构，冷阴极灯泡及其光致发光材料
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Application No.: US11160287Application Date: 2005-06-17
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Publication No.: US20060214562A1Publication Date: 2006-09-28
- Inventor: Chih-Chin Chang , Hsiang-Cheng Hsieh , Teng-Huei Huang
- Applicant: Chih-Chin Chang , Hsiang-Cheng Hsieh , Teng-Huei Huang
- Priority: TW94109063 20050324
- Main IPC: H01J1/62
- IPC: H01J1/62
Abstract:
An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0
Public/Granted literature
- US07479733B2 Light-emitting diode package structure, cold cathode flourescent lamp and photoluminescent material thereof Public/Granted day:2009-01-20
Information query
