- 专利标题: Optical semiconductor module and its manufacturing method
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申请号: US11442276申请日: 2006-05-30
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公开(公告)号: US20060215969A1公开(公告)日: 2006-09-28
- 发明人: Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
- 申请人: Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
- 优先权: JP2003-202441 20030728
- 主分类号: G02B6/36
- IPC分类号: G02B6/36
摘要:
An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
公开/授权文献
- US07255493B2 Optical semiconductor module and its manufacturing method 公开/授权日:2007-08-14
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