Invention Application
- Patent Title: High temperature metallic seal
- Patent Title (中): 高温金属密封
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Application No.: US11289198Application Date: 2005-11-28
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Publication No.: US20060218787A1Publication Date: 2006-10-05
- Inventor: D. More , Amitava Datta , Peter Amos
- Applicant: D. More , Amitava Datta , Peter Amos
- Main IPC: B21D53/84
- IPC: B21D53/84
Abstract:
A metallic seal includes a cold formed substrate layer and one or more additional layers. At least one of the layers offers improved resistance to high temperature stress relaxation.
Information query
