发明申请
- 专利标题： LGA socket with emi protection
- 专利标题（中）： LGA插座带emi保护
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申请号： US11078957申请日： 2005-03-11
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公开(公告)号： US20060220239A1公开(公告)日： 2006-10-05
- 发明人: David Trout , Richard Whyne
- 申请人： David Trout , Richard Whyne
- 专利权人： Tyco Electronics Corporation
- 当前专利权人： Tyco Electronics Corporation
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.
公开/授权文献
- US07170169B2 LGA socket with EMI protection 公开/授权日：2007-01-30
信息查询
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