发明申请
US20060220251A1 Reducing internal film stress in dielectric film 审中-公开
降低电介质膜内部膜应力

Reducing internal film stress in dielectric film
摘要:
A method of forming a film. The method comprises depositing a porous film. The porous film has active end groups; and preventing cross-linking among said active end groups, wherein the end groups are capped with less reactive or unreactive groups.
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