发明申请
- 专利标题: Distributed constant circuit and impedance adjustment method
- 专利标题(中): 分布式恒流和阻抗调整方法
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申请号: US11373095申请日: 2006-03-13
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公开(公告)号: US20060220761A1公开(公告)日: 2006-10-05
- 发明人: Hiroshi Ikeda
- 申请人: Hiroshi Ikeda
- 申请人地址: JP Chuo-ku
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP Chuo-ku
- 优先权: JP2005-104685 20050331
- 主分类号: H03H7/38
- IPC分类号: H03H7/38
摘要:
According to a conventional art, a large number of adjustment pads are necessary if impedance mismatching is large or characteristic impedance is low. Such a large number of the adjustment pads needs to secure a large area for arrangement of the adjustment pads preliminarily. However, occupation of a large area induces an interference with other distributed constant circuit. The present invention concerns a distributed constant circuit capable of adjusting the impedance matching between a conductor line such as micro strip line disposed in a small area and an electronic device in order to solve the above-described problems. This distributed constant circuit intends to achieve the impedance matching between the characteristic impedance of the conductor line and the load impedance or drive impedance of the electronic device by bringing the adjustment tab moving on a substrate into a contact with the conductor line.
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