发明申请
- 专利标题： Diffusion bonded nickel-copper powder metallurgy powder
- 专利标题（中）： 扩散接合镍铜粉末冶金粉末
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申请号： US11098693申请日： 2005-04-04
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公开(公告)号： US20060222554A1公开(公告)日： 2006-10-05
- 发明人: Tajpreet Singh , Scott Campbell , Thomas Stephenson , Ouan Yang
- 申请人： Tajpreet Singh , Scott Campbell , Thomas Stephenson , Ouan Yang
- 主分类号： B22F3/12
- IPC分类号： B22F3/12
摘要：
In contrast to current industrial practice where alloying powders are added to starting powder metallurgy compositions either as powder mixtures or fully prealloyed powders, the present invention posits a diffusion bonded nickel-copper precursor additive mixture for direct one step addition to the starting powder metallurgy master blend composition. Segregation and dusting are substantially reduced and the mechanical properties of the resultant compact are improved.
公开/授权文献
- US07309374B2 Diffusion bonded nickel-copper powder metallurgy powder 公开/授权日：2007-12-18
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