- 专利标题: High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same
-
申请号: US11358087申请日: 2006-02-22
-
公开(公告)号: US20060223931A1公开(公告)日: 2006-10-05
- 发明人: Eun Park , Jeong Kim , Hee Lee , Eun Lim , Jong Lee , Yul Chung
- 申请人: Eun Park , Jeong Kim , Hee Lee , Eun Lim , Jong Lee , Yul Chung
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2005-0027765 20050401
- 主分类号: C08K3/08
- IPC分类号: C08K3/08
摘要:
The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.
公开/授权文献
信息查询