发明申请
- 专利标题： Heat-dissipating module of electronic device
- 专利标题（中）： 电子设备散热模块
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申请号： US11302900申请日： 2005-12-14
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公开(公告)号： US20060227504A1公开(公告)日： 2006-10-12
- 发明人: Yin-Yuan Chen , Ren-Chun Chang , Chen-Yu Yu
- 申请人： Yin-Yuan Chen , Ren-Chun Chang , Chen-Yu Yu
- 专利权人： Delta Electronics, Inc.
- 当前专利权人： Delta Electronics, Inc.
- 优先权： TW094111386 20050411
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
The heat-dissipating module of the electronic device comprises a fan, a first heat-dissipating component and a second heat-dissipating component. The fan is disposed on a first side of the casing, and the first heat-dissipating component is disposed on a second side of the casing and in heat contact with the electronic components for transferring heat generated by the electronic components to the casing. The second heat-dissipating component is disposed on an outer sidewall of the casing corresponding to the first heat-dissipating component and in heat contact with a system cooling system. Thereby, the heat generated by the electronic components is transferred to the second heat-dissipating component through the first heat-dissipating component and the casing, and then dissipated by the system cooling device.
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