发明申请
US20060231930A1 Heat resistant photomask for high temperature fabrication processes
审中-公开
耐高温光掩模，用于高温制造工艺
- 专利标题： Heat resistant photomask for high temperature fabrication processes
- 专利标题（中）： 耐高温光掩模，用于高温制造工艺
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申请号： US11110090申请日： 2005-04-19
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公开(公告)号： US20060231930A1公开(公告)日： 2006-10-19
- 发明人: Satoru Araki , Robert Beach , Ying Hong , Thomas Leong , Timothy Minvielle , Howard Zolla
- 申请人： Satoru Araki , Robert Beach , Ying Hong , Thomas Leong , Timothy Minvielle , Howard Zolla
- 专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A temperature resistant photomask is disclosed which is made from photoresist containing Si, which is exposed to oxygen during Reactive Ion Etching. The temperature resistant photomask may include a secondary mask layer, which may also acts as a release layer, and which may include spin-on polymide. The photoresist containing Si may be exposed to oxygen during Reactive Ion Etching by introducing oxygen and carbon dioxide.