- 专利标题: Multilevel semiconductor module and method for fabricating the same
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申请号: US11405478申请日: 2006-04-18
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公开(公告)号: US20060231939A1公开(公告)日: 2006-10-19
- 发明人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
- 申请人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
- 优先权: JP2005-121484 20050419
- 主分类号: H01L23/02
- IPC分类号: H01L23/02
摘要:
A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.