发明申请
- 专利标题： Electronic device
- 专利标题（中）： 电子设备
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申请号： US10535857申请日： 2003-06-20
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公开(公告)号： US20060234420A1公开(公告)日： 2006-10-19
- 发明人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
- 申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
- 优先权： JP2002-337365 20021121; JP2002-337366 20021121
- 国际申请： PCT/JP03/07862 WO 20030620
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a mother board is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
公开/授权文献
- US07554039B2 Electronic device 公开/授权日：2009-06-30
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