发明申请
- 专利标题: Systems and methods for wiring circuit components
- 专利标题(中): 接线电路组件的系统和方法
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申请号: US11107038申请日: 2005-04-15
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公开(公告)号: US20060236290A1公开(公告)日: 2006-10-19
- 发明人: Eiichi Makino
- 申请人: Eiichi Makino
- 专利权人: Toshiba America Electronic Components
- 当前专利权人: Toshiba America Electronic Components
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Systems and methods for arranging parallel wires to reduce the capacitance variations. In one embodiment, multiple first components arranged as a linear array are coupled to a second component at the end of this linear array by corresponding signal wires. Each signal wire has a perpendicular portion extending perpendicular to the direction of the linear array, and a parallel portion which runs parallel to the direction of the linear array. The parallel portions are staggered so that longer ones of the parallel portions are adjacent to the shorter ones of the parallel portions, instead of simply being arranged from longest to shortest. In one embodiment, the longer half of the parallel portions decrease in length across the series of parallel portions, while the shorter half of the parallel portions increase in length. In another embodiment, successively longer/shorter parallel portions alternate sides of the series.
公开/授权文献
- US07219323B2 Systems and methods for wiring circuit components 公开/授权日:2007-05-15
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