发明申请
US20060237833A1 System having semiconductor component with multiple stacked dice
有权
具有多个堆叠骰子的半导体元件的系统
- 专利标题： System having semiconductor component with multiple stacked dice
- 专利标题（中）： 具有多个堆叠骰子的半导体元件的系统
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申请号： US11473731申请日： 2006-06-23
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公开(公告)号： US20060237833A1公开(公告)日： 2006-10-26
- 发明人: Dean Klein , Alan Wood , Trung Doan
- 申请人： Dean Klein , Alan Wood , Trung Doan
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate.
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