发明申请
- 专利标题: Adhesive injection process for Pi-joint assemblies
- 专利标题(中): 用于Pi接头组件的粘合剂注射过程
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申请号: US11111318申请日: 2005-04-21
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公开(公告)号: US20060243382A1公开(公告)日: 2006-11-02
- 发明人: Jeffrey Kilwin , Jim Piszar , Christopher Mathiesen
- 申请人: Jeffrey Kilwin , Jim Piszar , Christopher Mathiesen
- 申请人地址: US IL Chicago
- 专利权人: The Boeing Company
- 当前专利权人: The Boeing Company
- 当前专利权人地址: US IL Chicago
- 主分类号: B29C65/00
- IPC分类号: B29C65/00
摘要:
An adhesive injection process for a Pi-joint assembly comprises the steps of: machining at least two ports into a female part of a Pi-joint assembly; inserting a filler into a gap between a male part and the female part; applying a sealant above the filler; creating a vacuum with a vacuum pump at one port; injecting an adhesive through another port; and drawing the adhesive towards the vacuum pump until the gap under the filler is completely filled with the adhesive. The adhesive injection process incorporates lean technologies that enable increased productivity during the assembly of a Pi-joint design using adhesive bonding. The adhesive injection process is suitable for, but not limited to, applications in the aerospace industry, such as the aircraft airframe assembly. The adhesive injection process may be used for the bonding of upper and lower skins to airframe structure as well as for structure-to-structure bonding.
公开/授权文献
- US07645406B2 Adhesive injection process for Pi-joint assemblies 公开/授权日:2010-01-12
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