发明申请
- 专利标题: Insulating and thermally conductive resin composition, molded article and method of producing the composition
- 专利标题(中): 绝热导热性树脂组合物,成型品及其制造方法
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申请号: US11411091申请日: 2006-04-26
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公开(公告)号: US20060247355A1公开(公告)日: 2006-11-02
- 发明人: Wataru Kosaka , Takuji Harano , Yoshikazu Inada
- 申请人: Wataru Kosaka , Takuji Harano , Yoshikazu Inada
- 优先权: JP2005-131583 20050428; JP2006-035183 20060213
- 主分类号: C08K3/08
- IPC分类号: C08K3/08
摘要:
To provide an insulating and thermally conductive resin composition from which a molded article having a high insulating properties and a high thermal conductivity can be produced and which is excellent in moldability, a molded article, and a method of producing the resin composition. The insulating and thermally conductive resin composition of the invention includes at least 30% by volume or more of a thermoplastic resin, 10 to 40% by volume of metallic aluminum type filler, and 5 to 25% by volume of a flame retardant. Particularly, addition of 1 to 10% by volume of a metal powder having a melting point of 500° C. or higher and 1 to 10% by volume of a low melting point alloy having a melting point of 500° C. or lower can provide more isotropic thermal conduction.
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