发明申请
- 专利标题： Seed layers, cap layers, and thin films and methods of making thereof
- 专利标题（中）： 种子层，盖层和薄膜及其制造方法
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申请号： US11433824申请日： 2006-05-15
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公开(公告)号： US20060254503A1公开(公告)日： 2006-11-16
- 发明人: Haixia Dai , Khashayar Pakbaz , Michael Spaid , Theo Nikiforov
- 申请人： Haixia Dai , Khashayar Pakbaz , Michael Spaid , Theo Nikiforov
- 专利权人： Cambrios Technologies Corporation
- 当前专利权人： Cambrios Technologies Corporation
- 主分类号： C30B23/00
- IPC分类号： C30B23/00
摘要：
A seed layer is formed on a substrate using a first biological agent. The seed layer may comprise densified nanoparticles which are bound to the biological agent. The seed layer is then used for a deposition of a metal layer, such as a barrier layer, an interconnect layer, a cap layer and/or a bus line for a solid state device.
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