发明申请
- 专利标题： Semiconductor integrated circuit
- 专利标题（中）： 半导体集成电路
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申请号： US10565006申请日： 2004-08-31
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公开(公告)号： US20060258135A1公开(公告)日： 2006-11-16
- 发明人: Yasuyo Sogawa , Kazuhiko Nishikawa , Masanori Hirofuji
- 申请人： Yasuyo Sogawa , Kazuhiko Nishikawa , Masanori Hirofuji
- 申请人地址： JP Kadoma-shi
- 专利权人： Matsushita Electtric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electtric Industrial Co., Ltd.
- 当前专利权人地址： JP Kadoma-shi
- 优先权： JP2003-330344 20030922
- 国际申请： PCT/JP04/12904 WO 20040831
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
Each of plural semiconductor integrated circuits existing on a semiconductor wafer is provided with a function circuit (3), plural pads (4), and wirings (8) which are electrically connected to the pads (4) and contact bumps of a probe card (7), wherein at least two wirings (8a) and (8b) simultaneously contact one bump (6) in an area other than a bump area, without being in touch with each other, whereby wafer level burn-in is executed. Thereby, even when the chip area is reduced, wafer level burn-in can be carried out.
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