发明申请
- 专利标题： Thermal management of electronic devices
- 专利标题（中）： 电子设备的热管理
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申请号： US11268669申请日： 2005-11-07
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公开(公告)号： US20060261304A1公开(公告)日： 2006-11-23
- 发明人: Poongunran Muthukumaran , Nurten Emek
- 申请人： Poongunran Muthukumaran , Nurten Emek
- 申请人地址： US MA Northborough
- 专利权人： Aspen Aerogels, Inc.
- 当前专利权人： Aspen Aerogels, Inc.
- 当前专利权人地址： US MA Northborough
- 主分类号： E04B1/74
- IPC分类号： E04B1/74 ; H01M8/04
摘要：
Embodiments of the present invention describe an insulated electronic device comprising a heat generating component at least partially covered with at least one layer of a fiber reinforced aerogel composite. Furthermore, methods for insulating electronic devices such as, but not limited to, various fuel cells are described.