发明申请
- 专利标题： Solid element device and method for manufacturing thereof
- 专利标题（中）： 固体元件装置及其制造方法
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申请号： US10548560申请日： 2004-03-10
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公开(公告)号： US20060261364A1公开(公告)日： 2006-11-23
- 发明人: Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
- 申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
- 优先权： JP2003-063015 20030310; JP2003-160867 20030605; JP2003-160855 20030605; JP2003-193182 20030707; JP2003-342705 20030930; JP2003-342706 20030930; JP2004-010385 20040119
- 国际申请： PCT/JP04/03089 WO 20040310
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
公开/授权文献
- US07824937B2 Solid element device and method for manufacturing the same 公开/授权日：2010-11-02
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