A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.