发明申请
US20060261482A1 Apparatus and method for testing component built in circuit board
有权
用于测试电路板内置组件的装置和方法
- 专利标题： Apparatus and method for testing component built in circuit board
- 专利标题（中）： 用于测试电路板内置组件的装置和方法
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申请号： US11131741申请日： 2005-05-18
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公开(公告)号： US20060261482A1公开(公告)日： 2006-11-23
- 发明人: Uei-Ming Jow , Min-Lin Lee , Shinn-Juh Lay , Chin-Sun Shyu , Chang-Sheng Chen
- 申请人： Uei-Ming Jow , Min-Lin Lee , Shinn-Juh Lay , Chin-Sun Shyu , Chang-Sheng Chen
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of the at least one signal pad corresponding to one of the multiple terminals, and at least one test pad formed on the top surface of the multi-layered circuit board, each of the at least one test pad corresponding to one of the at least one signal pad for testing an electric path extending from the one signal pad through the one terminal to the each of the at least one test pad.
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