An alignment mark for aligning a resist film and a silk film relative to a printed circuit board is used as a reference mark based on which a position of an electronic component on the printed circuit board is acquired when a component mounting machine mounts the electronic component on the printed circuit board. This makes it unnecessary to additionally provide a board recognition mark and an individual recognition mark, thereby making it possible to effectively use an area of the printed circuit board. In addition, since the number of marks to be recognized is decreased, a recognition processing is reduced. Accordingly, mounting time and a mounting program can be reduced, and a manufacturing cost of the printed circuit board can be reduced.