An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.