发明申请
- 专利标题: Low profile structure
- 专利标题(中): 薄型结构
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申请号: US11432353申请日: 2006-05-12
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公开(公告)号: US20060270251A1公开(公告)日: 2006-11-30
- 发明人: Chien-Jung Chen , Chih-Peng Wu , Yu-Liang Liu
- 申请人: Chien-Jung Chen , Chih-Peng Wu , Yu-Liang Liu
- 申请人地址: TW Taipei City
- 专利权人: ASUSTek COMPUTER INC.
- 当前专利权人: ASUSTek COMPUTER INC.
- 当前专利权人地址: TW Taipei City
- 优先权: TW094117853 20050531
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
A low profile structure is disclosed. The structure includes a printed circuit board (PCB), a bracket, three connectors and an extending module, wherein the bracket is connected to the PCB to form the body of the low profile structure. In addition, one of the connectors is an extending connector and the other two connectors are configured on the bracket and are directly connected with PCB. The extending module further includes an extending PCB so that the extending PCB is electrically connected to the extending connector and the extending PCB is electrically connected to PCB. Therefore, the extending connector can be electrically connected to PCB via the extending PCB.
公开/授权文献
- US07445468B2 Low profile structure 公开/授权日:2008-11-04
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