- 专利标题: Structure of inkjet-head chip
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申请号: US11505647申请日: 2006-08-17
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公开(公告)号: US20060272147A1公开(公告)日: 2006-12-07
- 发明人: Chien-Hung Liu , Jian-Chiun Liou , Chi-Ming Huang , Chia-Cheng Chiao , Chun-Jung Chen
- 申请人: Chien-Hung Liu , Jian-Chiun Liou , Chi-Ming Huang , Chia-Cheng Chiao , Chun-Jung Chen
- 优先权: TW92132074 20031114
- 主分类号: B41J2/205
- IPC分类号: B41J2/205
摘要:
A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
公开/授权文献
- US07527360B2 Structure of inkjet-head chip 公开/授权日:2009-05-05
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