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发明申请
US20060275987A1 Method of forming stack layer and method of manufacturing electronic device having the same 失效
形成叠层的方法及其制造方法

Method of forming stack layer and method of manufacturing electronic device having the same
摘要：
A method of forming a stacked structure in an electronic device, where a photoresist for performing multi-patterning processes is used. Also, a method of manufacturing a FED in which different structures can be multi-patterned by using a single photoresist mask. The photoresist has a solubility to a solvent by heat-treatment after exposure, and a complicated structure can be formed using the photoresist.
摘要（中）：

在电子器件中形成堆叠结构的方法，其中使用用于进行多图案化工艺的光致抗蚀剂。 另外，通过使用单一的光致抗蚀剂掩模，能够使不同的结构多层化的FED的制造方法。 光致抗蚀剂在曝光后通过热处理对溶剂具有溶解性，并且可以使用光致抗蚀剂形成复杂的结构。

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