发明申请
US20060276041A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
审中-公开
化学机械抛光水性分散体，化学机械抛光方法和制备化学机械抛光水性分散体的试剂盒
- 专利标题： Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
- 专利标题（中）： 化学机械抛光水性分散体，化学机械抛光方法和制备化学机械抛光水性分散体的试剂盒
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申请号： US11433508申请日： 2006-05-15
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公开(公告)号： US20060276041A1公开(公告)日： 2006-12-07
- 发明人: Kazuhito Uchikura , Tomohisa Konno , Nobuo Kawahashi , Masayuki Hattori
- 申请人： Kazuhito Uchikura , Tomohisa Konno , Nobuo Kawahashi , Masayuki Hattori
- 申请人地址： JP Chuo-ku
- 专利权人： JSR CORPORATION
- 当前专利权人： JSR CORPORATION
- 当前专利权人地址： JP Chuo-ku
- 优先权： JP2005-143580 20050517
- 主分类号： C09K13/00
- IPC分类号： C09K13/00 ; H01L21/461 ; C03C15/00 ; H01L21/302
摘要：
A chemical mechanical polishing aqueous dispersion, including: (A) inorganic particles; (B) at least one type of particles selected from the group consisting of organic particles and organic-inorganic composite particles; (C) at least one compound selected from the group consisting of quinolinecarboxylic acid, quinolinic acid, a divalent organic acid (excluding quinolinic acid), and a hydroxyl acid; (D) at least one compound selected from the group consisting of benzotriazole and benzotriazole derivatives; (E) an oxidizing agent; and (F) water, the chemical mechanical polishing aqueous dispersion containing the component (A) in an amount of 0.05 to 2.0 wt % and the component (B) in an amount of 0.005 to 1.5 wt %, having a ratio (WA/WB) of the amount (WA) of the component (A) to the amount (WB) of the component (B) of 0.1 to 200, and having a pH of 1.0 to 5.0.
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