- 专利标题： Techniques and devices for characterizing spatially non-uniform curvatures and stresses in thin-film structures on substrates with non-local effects
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申请号： US11432663申请日： 2006-05-10
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公开(公告)号： US20060276977A1公开(公告)日： 2006-12-07
- 发明人: Ares Rosakis , Yonggang Huang
- 申请人： Ares Rosakis , Yonggang Huang
- 主分类号： G01L1/00
- IPC分类号： G01L1/00
摘要：
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location. Techniques and devices for determining a misfit strain between a film and a substrate on which the film is deposited are also described.
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