Invention Application
- Patent Title: Substrate-free flip chip light emitting diode and manufacturing method thereof
- Patent Title (中): 无基板倒装芯片发光二极管及其制造方法
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Application No.: US11148606Application Date: 2005-06-08
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Publication No.: US20060278884A1Publication Date: 2006-12-14
- Inventor: Ching-Chung Chen
- Applicant: Ching-Chung Chen
- Main IPC: H01L29/22
- IPC: H01L29/22
Abstract:
A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.
Public/Granted literature
- US07625778B2 Method of manufacturing a substrate-free flip chip light emitting diode Public/Granted day:2009-12-01
Information query
IPC分类:
