Invention Application
- Patent Title: LED package, manufacturing method thereof, and LED array module using the same
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Application No.: US11405567Application Date: 2006-04-18
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Publication No.: US20060279949A1Publication Date: 2006-12-14
- Inventor: Kyu-ho Shin , Su-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Jin-seung Choi
- Applicant: Kyu-ho Shin , Su-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Jin-seung Choi
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR2005-0049896 20050610
- Main IPC: F21V5/04
- IPC: F21V5/04 ; H01L33/00 ; H01S4/00
Abstract:
An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.
Public/Granted literature
- US07514718B2 LED package, manufacturing method thereof, and LED array module using the same Public/Granted day:2009-04-07
Information query
