发明申请
US20060281271A1 Method of forming a semiconductor device having an epitaxial layer and device thereof
审中-公开
形成具有外延层的半导体器件的方法及其装置
- 专利标题: Method of forming a semiconductor device having an epitaxial layer and device thereof
- 专利标题(中): 形成具有外延层的半导体器件的方法及其装置
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申请号: US11150899申请日: 2005-06-13
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公开(公告)号: US20060281271A1公开(公告)日: 2006-12-14
- 发明人: David Brown , William En , Thorsten Kammler , Paul Besser , Scott Luning
- 申请人: David Brown , William En , Thorsten Kammler , Paul Besser , Scott Luning
- 申请人地址: US CA Sunnyvale
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US CA Sunnyvale
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
Integration schemes are presented which provide for decoupling the placement of deep source/drain (S/D) implants with respect to a selective epitaxial growth (SEG) raised S/D region, as well as decoupling silicide placement relative to a raised S/D feature. These integration schemes may be combined in multiple ways to permit independent control of the placement of these features for optimizing device performance. The methodology utilizes multiple spacers to decrease current crowding effects in devices due to proximity effects between LDD and deep S/D regions in reduced architecture devices.
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