Invention Application
- Patent Title: Thin film plate phase change RAM circuit and manufacturing method
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Application No.: US11155202Application Date: 2005-06-17
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Publication No.: US20060284157A1Publication Date: 2006-12-21
- Inventor: Shih-Hung Chen , Hsiang Lung
- Applicant: Shih-Hung Chen , Hsiang Lung
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A memory device comprising a access circuits, an electrode layer over the access circuits, an array of phase change memory bridges over the electrode layer, and a plurality of bit lines over the array of phase change memory bridges. The electrode layer includes electrode pairs. Electrode pairs include a first electrode having a top side, a second electrode having a top side and an insulating member between the first electrode and the second electrode. A bridge of memory material crosses the insulating member, and defines an inter-electrode path between the first and second electrodes across the insulating member.
Public/Granted literature
- US07238994B2 Thin film plate phase change ram circuit and manufacturing method Public/Granted day:2007-07-03
Information query
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