- 专利标题： Method for reducing PSA tilt through standoff relocation
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申请号： US11152947申请日： 2005-06-15
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公开(公告)号： US20060285251A1公开(公告)日： 2006-12-21
- 发明人: Shinobu Hagiya , Shigeo Nakamura , Wing Shum
- 申请人： Shinobu Hagiya , Shigeo Nakamura , Wing Shum
- 主分类号： G11B5/60
- IPC分类号： G11B5/60
摘要：
A head assembly for a data storage device. The head assembly has a suspension. The head assembly also includes a contact pad coupled to the suspension. The head assembly also includes a slider. The slider is coupled to the suspension at the slider mounting point. The slider mounting point is at least partially bounded by polyimide standoffs. The polyimide standoff closest to the contact pad is positioned to reduce the effect of the solder shrinkage moment.
公开/授权文献
- US07545605B2 Method for reducing PSA tilt through standoff relocation 公开/授权日：2009-06-09
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