发明申请
US20060286189A1 METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIVE CIRCUIT ELEMENTS
有权
用于密封具有热敏电路元件的柔性电路的方法和装置
- 专利标题： METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIVE CIRCUIT ELEMENTS
- 专利标题（中）： 用于密封具有热敏电路元件的柔性电路的方法和装置
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申请号： US11463087申请日： 2006-08-08
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公开(公告)号： US20060286189A1公开(公告)日： 2006-12-21
- 发明人: C.W. Smith , Charles Newton , Paul Jaynes
- 申请人： C.W. Smith , Charles Newton , Paul Jaynes
- 主分类号： A23G3/12
- IPC分类号： A23G3/12
摘要：
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
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