Invention Application
- Patent Title: Polishing pad comprising magnetically sensitive particles and method for the use thereof
- Patent Title (中): 包含磁敏颗粒的抛光垫及其使用方法
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Application No.: US11158185Application Date: 2005-06-21
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Publication No.: US20060286906A1Publication Date: 2006-12-21
- Inventor: Ronald Myers , Abaneshwar Prasad
- Applicant: Ronald Myers , Abaneshwar Prasad
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Main IPC: B24B7/30
- IPC: B24B7/30
Abstract:
The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied magnetic field. The invention further provides a polishing system and a method for polishing a substrate involving such a polishing pad.
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