发明申请
- 专利标题： Laser machining apparatus
- 专利标题（中）： 激光加工设备
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申请号： US11512550申请日： 2006-08-30
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公开(公告)号： US20060289410A1公开(公告)日： 2006-12-28
- 发明人: Terumasa Morita , Susumu Takahashi
- 申请人： Terumasa Morita , Susumu Takahashi
- 优先权： JPP2004-62225 20040503; JPP2004-62226 20040503
- 主分类号： B23K26/38
- IPC分类号： B23K26/38 ; B23K26/06
摘要：
A laser machining apparatus, provided with a stage on which a workpiece is placed, an emission device for emitting laser light toward a surface of the workpiece, an optical system for splitting the laser light into a plurality of beams, and for focusing the beams as a plurality of spots on the surface of or within the workpiece, and a movement device for moving the plurality of spots in a horizontal direction relative to the workpiece.
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