发明申请
- 专利标题： Stacked semiconductor component, fabrication method and fabrication system
- 专利标题（中）： 堆叠半导体元件，制造方法和制造系统
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申请号： US11167367申请日： 2005-06-27
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公开(公告)号： US20060289992A1公开(公告)日： 2006-12-28
- 发明人: Alan Wood
- 申请人： Alan Wood
- 专利权人： MICRON TECHNOLOGY, INC.
- 当前专利权人： MICRON TECHNOLOGY, INC.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also include terminal contacts on the carrier in electrical communication with the conductive members, and an outer member for protecting the semiconductor substrates. A method for fabricating the component includes the steps of providing the carrier with the conductive members, and providing the semiconductor substrates with the conductive openings. The method also includes the step of aligning and placing the conductive openings on the conductive members, and then bonding the conductive members to the conductive openings. A system includes the carrier having the conductive members, the semiconductor substrates having the conductive openings, an aligning and placing system for aligning and placing the semiconductor substrates on the carrier, and a bonding system for bonding the conductive members to the conductive openings.
公开/授权文献
- US07589406B2 Stacked semiconductor component 公开/授权日：2009-09-15
信息查询
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