发明申请
- 专利标题： HEAT DISSIPATION DEVICE WITH HEAT PIPE
- 专利标题（中）： 热管散热装置
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申请号： US11164592申请日： 2005-11-30
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公开(公告)号： US20070000646A1公开(公告)日： 2007-01-04
- 发明人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
- 申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
- 优先权： CN200510035775.3 20050702
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.
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