- 专利标题： Semiconductor device
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申请号： US11256273申请日： 2005-10-24
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公开(公告)号： US20070001317A1公开(公告)日： 2007-01-04
- 发明人: Yoshihiro Matsuoka , Kazuyuki Imamura , Masao Oshima , Takashi Suzuki , Toyoji Sawada
- 申请人： Yoshihiro Matsuoka , Kazuyuki Imamura , Masao Oshima , Takashi Suzuki , Toyoji Sawada
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2005-195432 20050704
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.
公开/授权文献
- US07268433B2 Semiconductor device 公开/授权日：2007-09-11
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