A pulling assembly is provided for pulling an electronic module out of a computer enclosure. The pulling assembly includes an installing portion, a pulling member and an manipulating section. The installing portion is formed on the computer enclosure. The pulling member is slidably arranged in the computer enclosure by the installing portion. The manipulating section pivotally connected to the pulling member. The manipulating section drives the pulling member to slide along the installing portion and the pulling member pulls the electronic module to slide a certain distance to facilitate the electronic module being taken out from the computer enclosure.