发明申请
US20070004166A1 Method for fabricating capacitor of semiconductor device 失效
制造半导体器件电容器的方法

  • 专利标题: Method for fabricating capacitor of semiconductor device
  • 专利标题(中): 制造半导体器件电容器的方法
  • 申请号: US11269095
    申请日: 2005-11-08
  • 公开(公告)号: US20070004166A1
    公开(公告)日: 2007-01-04
  • 发明人: Soo Lee
  • 申请人: Soo Lee
  • 申请人地址: KR Icheon-Shi
  • 专利权人: HYNIX SEMICONDUCTOR INC.
  • 当前专利权人: HYNIX SEMICONDUCTOR INC.
  • 当前专利权人地址: KR Icheon-Shi
  • 优先权: KR2005-58774 20050630
  • 主分类号: H01L21/00
  • IPC分类号: H01L21/00
Method for fabricating capacitor of semiconductor device
摘要:
Disclosed herein is a method for fabricating a capacitor of a semiconductor device. The method comprises the steps of forming an interlayer insulating film on a semiconductor substrate, forming contact plugs connected to the semiconductor substrate though the interlayer insulating film, forming a first storage node oxide film include a PSG film on the contact plugs, cleaning the semiconductor substrate on which the first storage node oxide film include a PSG film is formed, using isopropyl alcohol (IPA), to remove water-soluble compounds, and forming a second storage node oxide film on the first storage node oxide film.
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