发明申请
- 专利标题： Molding composition and method, and molded article
- 专利标题（中）： 成型组合物和成型品
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申请号： US11172300申请日： 2005-06-30
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公开(公告)号： US20070004872A1公开(公告)日： 2007-01-04
- 发明人: Qiwei Lu , Michael O'Brien , Gerardo Rocha-Galicia , Prameela Susarla
- 申请人： Qiwei Lu , Michael O'Brien , Gerardo Rocha-Galicia , Prameela Susarla
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08L71/02
摘要：
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
公开/授权文献
- US07429800B2 Molding composition and method, and molded article 公开/授权日：2008-09-30
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