发明申请
- 专利标题： Method for manufacturing semiconductor chip package
- 专利标题（中）： 制造半导体芯片封装的方法
-
申请号： US11516558申请日： 2006-09-07
-
公开(公告)号： US20070007634A1公开(公告)日： 2007-01-11
- 发明人: Cheul-Joong Youn , Sang-Yeop Lee , Sang-Hyeop Lee
- 申请人： Cheul-Joong Youn , Sang-Yeop Lee , Sang-Hyeop Lee
- 优先权： KR2004-30089 20040429
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/00
摘要：
A semiconductor chip package may have through holes extending from a chip contact surface of a film type die attaching material to a second surface of a die pad. A resin encapsulant may extend into the through holes to directly contact portions of a semiconductor chip that are superposed over the through holes. The through holes may be formed using a stamping method.