- 专利标题: Photoresist composition for imaging thick films
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申请号: US11179364申请日: 2005-07-12
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公开(公告)号: US20070015080A1公开(公告)日: 2007-01-18
- 发明人: Medhat Toukhy , Ping-Hung Lu , Salem Mullen
- 申请人: Medhat Toukhy , Ping-Hung Lu , Salem Mullen
- 主分类号: G03C1/00
- IPC分类号: G03C1/00
摘要:
The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a strong acid upon irradiation and a photobleachable dye. The invention further provides for a process for imaging the photoresist of the present invention, especially where the thickness of the photoresist is up to 200 microns and where the process comprises a single exposure step.
公开/授权文献
- US07255970B2 Photoresist composition for imaging thick films 公开/授权日:2007-08-14
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