An apparatus for drying a substrate is provided. In one embodiment, the apparatus includes a drying room in which a support member for supporting a plurality of wafers is disposed. The apparatus further includes a drying gas-supply element for supplying a drying gas to the substrates supported by the support member. The drying gas-supply element includes nozzles located within the drying room and arranged in a plurality of groups, and supply pipes for supplying a drying gas to the nozzles. Nozzles belonging to a first group are formed such that the density of the openings in a spray port is higher in a front region than in other regions, and nozzles belonging to a second group are formed such that density of openings in a spray port is higher in a rear region than in other regions. Different supply pipes can be connected to nozzles belonging to different groups, and a flow control valve can be installed in each of the supply pipes.