Invention Application
US20070018335A1 Polygonal, rounded, and circular flip chip ball grid array board
审中-公开
多边形，圆形和圆形倒装芯片球栅阵列板
- Patent Title: Polygonal, rounded, and circular flip chip ball grid array board
- Patent Title (中): 多边形，圆形和圆形倒装芯片球栅阵列板
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Application No.: US11483844Application Date: 2006-07-11
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Publication No.: US20070018335A1Publication Date: 2007-01-25
- Inventor: Seung-Hyun Cho , Soon-Jin Cho , Jae-Joon Lee , Se-Jong Oh
- Applicant: Seung-Hyun Cho , Soon-Jin Cho , Jae-Joon Lee , Se-Jong Oh
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2005-0062274 20050711
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.
Information query
IPC分类:
