Invention Application
- Patent Title: METHOD FOR IMPEDANCE MATCHING BETWEEN DIFFERENTIAL VIAS AND TRANSMISSION LINES
- Patent Title (中): 差分线与传输线之间的阻抗匹配方法
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Application No.: US11308690Application Date: 2006-04-22
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Publication No.: US20070018751A1Publication Date: 2007-01-25
- Inventor: SHOU-KUO HSU , CHENG-HONG LIU
- Applicant: SHOU-KUO HSU , CHENG-HONG LIU
- Applicant Address: TW TU CHENG
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW TU CHENG
- Priority: CN200510036126.5 20050721
- Main IPC: H03H7/38
- IPC: H03H7/38
Abstract:
A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of the differential vias matches a characteristic impedance of the differential transmission lines; and determining the space and the radius according to the relationship between the space and the radius.
Public/Granted literature
- US07443265B2 Method for impedance matching between differential vias and transmission lines Public/Granted day:2008-10-28
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