发明申请
- 专利标题： Vacuum processing apparatus and vacuum processing method
- 专利标题（中）： 真空加工设备和真空加工方法
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申请号： US11518894申请日： 2006-09-12
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公开(公告)号： US20070023683A1公开(公告)日： 2007-02-01
- 发明人: Yoshitaka Kai , Kenichi Kuwabara , Takeo Uchino , Yasuhiro Nishimori , Takeshi Oono , Takeshi Shimada
- 申请人： Yoshitaka Kai , Kenichi Kuwabara , Takeo Uchino , Yasuhiro Nishimori , Takeshi Oono , Takeshi Shimada
- 优先权： JP2004-097773 20040330
- 主分类号： G01F23/00
- IPC分类号： G01F23/00
摘要：
A vacuum processing apparatus and method includes a sample taken out from a given cassette placed on a cassette support in atmosphere, the sample is carried into a vacuum processing chamber via a chamber enabling switching between atmosphere and vacuum, the sample is subjected to etching processing in the vacuum processing chamber, and at least one inspection process is carried out in the vacuum either before or after etching of the sample in the vacuum processing chamber. The at least one inspection process in the vacuum is a defect inspection.
信息查询
