发明申请
- 专利标题： Semiconductor device-composing substrate and semiconductor device
- 专利标题（中）： 半导体器件组成衬底和半导体器件
-
申请号： US11543084申请日： 2006-10-05
-
公开(公告)号： US20070023906A1公开(公告)日： 2007-02-01
- 发明人: Yoichiro Kurita , Koji Soejima , Masaya Kawano
- 申请人： Yoichiro Kurita , Koji Soejima , Masaya Kawano
- 申请人地址： JP Kawasaki
- 专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2005-294960 20050710
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device-composing substrate 10 has a support base 12, an interconnect layer 14 including interconnects 13, and an insulating resin layer 16. The semiconductor device-composing substrate 10 also has a mounting region D1 on which a semiconductor chip 30 is to be mounted. The insulating resin layer 16 is formed on the interconnect layer 14. Chip-connecting electrodes 17, external electrode pads 18 and the resin stopper patterns 19 are formed in the insulating resin layer 16. The chip-connecting electrodes 17 are provided in the mounting region D1. The external electrode pads 18 are provided outside the mounting region D1. The resin stopper patterns 19 are provided between the mounting region D1 and the external electrode pads 18.
公开/授权文献
信息查询
IPC分类:
